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Design and engineering of electronic equipment

All lectures: All lectures at the Academy of Intelligence on the discipline: design and engineering of electronic equipment. These fascinating lectures provide us with the opportunity to explore the deep principles and phenomena underlying our knowledge and our desire to understand the world.
1. Board development process
2. PCB structure
3. Printed wiring rules
4. Rules for the placement of electronic products (IET)
5. Optimality Criteria for Topological Design of Boards
6. Printed circuit boards
7. Elements of a conductive PCB pattern
8. Printed installation
9. Restrictions on disaggregation by design complexity
10. Disintegration of radio-electronic facilities by constructive complexity
11. Levels of downsizing RES
12. Push-button and touch controls
13. Arrow and scale indicators
14. Criteria for the selection of soybeans and oy
15. Work on the implementation of the technical specifications of the design and design of the PCB
16. Technical level map (for developed, modernized and mass-produced products
17. Technical and economic characteristics of the product
18. Operating conditions (use), requirements for maintenance and repair
19. Patent clearance requirements
20. Requirements for the level of unification and standardization advantages and disadvantages
21. Requirements for manufacturability and metrological support
22. Limitations associated with standardization
23. Standards in the design and construction of electronic devices
24. Development of standardization in the RES
25. Microminiaturization and mass (dimensions) of RES
26. The essence of the principle of microminiaturization
27. Methods for finding the optimum
28. RES Synthesis and Optimization
29. System approach and probabilistic methods
30. Formation of the design and technology of RES as an independent direction in the system of structures and technologies and as the most important field of radio electronics
31. Development of RES
32. Design Technologist RES
33. The subsystems of radio-electronic devices allocated by the design-technological features
34. RES subsystems allocated by their functions
35. Unbundling of RES
36. Purpose, properties and classification of radio electronic means (RES)
37. Radio system
38. Radio engineering, radio electronics and the development of society
39. Radio Electronics Features
40. Radio engineering, radio electronics
41. SURFACE INSTALLATION of elements on the printed circuit board
42. MIXED INSTALLATION OF ELEMENTS ON THE PRINTING BOARD AND COMPLETE ASSEMBLY STAGES
43. DISPLAYING PCB elements
44. solders and fluxes used when mounting radio elements on a printed circuit board
45. radioelement soldering technology
46. PCB Manufacturing
47. PCB DEVELOPMENT (design) technology and production control
48. The use of photolithography in the manufacture of electronic equipment
49. Comparative characteristics of thick-film and thin-film microcircuits
50. PCB PRODUCTION TECHNOLOGY
51. PCB Design and Production Technologies
52. PCB on metal base
53. Power Surface Mount Resistors
54. Resistors Ratings
55. Surface Mount Resistors
56. Surface Mount Capacitors
57. Surface Mount Inductance (smd inductance)
58. The tasks of designing electronic equipment (REA)
59. Thermal calculations of the electronic device Cooling REA
60. Surface Mount Enclosures (SMD)
61. EUV lithography
62. Electronic cooling systems
63. Heat-shrink tubing . Specifications. Application.
64. Electronic lithography
65. Optical nanolithography. Her species
66. Atomic Nanolithography, Nanoimprint lithography Replication of nanostructures, Nanoprint lithography
67. Standardization of quality requirements.
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