radioelement soldering technology

The connection of two parts using a fusible alloy is called soldering. Unlike welding, the fusion of parts being joined does not occur, the soldering process is more like gluing parts, where heated solder acts as an adhesive - an alloy that has a fairly low melting point. Soldering is the main way to create a permanent connection of components with the conductors of the board. For a good solder joint, the surfaces of the parts are prepared by applying a flux. Details in the soldering area are heated by soldering equipment to a temperature above the melting point of the solder. Solder spreads over the surface and displaces the flux. There is a wetting of the joined surfaces. The alloy zone is formed during the diffusion of solder and surfaces of the parts to be joined.

Solder component pin.

If the area of ​​the conductive path of the board is large or soldering of the output of the massive component occurs, then it may take longer to heat the soldering area. For such rations you need to use a soldering iron of greater power. Otherwise, the float zone will not form and a “cold” soldering will occur, giving a poor electrical contact.

“Cold” soldering.

If the wetting does not take place sufficiently, the solder first covers the surface and then collects, forming bumps and baring the contact pad on the board. This can be caused by deterioration of the flux properties, improper soldering temperature, surface contamination, or vapors of the flux solvent.

Bad wetting with solder output component.